SMI-M8 Semiconductor Wafer Bumping Stencil AOI Inspection Machine
High-Precision Automated Inspection for Electroformed Metal Stencils
The SMI-M8 AOI Inspection Machine is designed for high-accuracy defect detection in semiconductor wafer bumping stencils and electroformed metal masks.
It combines AI deep learning with advanced optical imaging systems.
The machine performs fast, non-contact inspection with pixel-level precision.
It is widely used in semiconductor, PCB, and photovoltaic manufacturing industries.
Advanced AI and Optical Inspection Technology
The system integrates a 20-megapixel industrial camera with dual telecentric lenses.
This ensures distortion-free imaging of fine stencil features.
High-brightness LED lighting supports stable and uniform illumination.
The inspection engine combines graphic algorithms, traditional algorithms, and AI deep learning.
CAM data in Gerber 274X format is automatically imported and analyzed.
The AOI Inspection Machine identifies and classifies defects in real time.
High Performance Inspection Capability
The system supports large-format stencil inspection up to 736mm × 736mm.
Effective inspection area reaches 620mm × 620mm.
Pixel resolution is approximately 2.4μm for fine defect detection.
Inspection speed ranges from 100 to 200 seconds per piece.
Automatic laser autofocus ensures stable imaging accuracy.
SPC statistical analysis supports full traceability and process control.
Defect Detection Functions
This AOI Inspection Machine detects a wide range of critical defects.
Typical defect types include:
- Hole blockage and missing features
- Foreign particles and contamination
- Pattern deformation and abnormal shapes
- Position offset and misalignment
- Over-cutting and under-cutting
- Pinholes and surface defects
- Wire remnants and bridging issues
Custom thresholds help maintain balanced quality control standards.
Industrial Applications
The system is essential for zero-defect manufacturing environments.
Typical applications include:
- Semiconductor wafer bumping stencils
- Electroformed metal masks
- Photovoltaic screen printing
- Microelectronics production
- PCB precision manufacturing
- Nickel sheet inspection with fixtures
It supports full-process inspection and MES integration.
Key Advantages
- AI-powered defect recognition
- High-resolution telecentric optical system
- Automatic CAM data parsing
- Non-contact high-speed inspection
- SPC and MES data connectivity
- Stable vibration-resistant platform
- Customizable inspection thresholds
- Flexible production compatibility
System Integration and Control
The AOI Inspection Machine runs on Windows 11 Professional IPC hardware.
It supports barcode scanning and MES communication protocols.
User permission levels can be customized for factory management.
Inspection results are stored for traceability and offline analysis.
OEM and Customization Services
Customized pixel resolution and inspection modes are available.
Communication protocols can be tailored for MES systems.
Hardware integration options support different production lines.
The SMI-M8 AOI Inspection Machine delivers intelligent inspection, high-speed analysis, and reliable defect detection for advanced semiconductor manufacturing.
